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DATA SHEET
BIPOLAR ANALOG INTEGRATED CIRCUIT
PC1694GR
GENERAL PURPOSE HIGH FREQUENCY WIDEBAND IC FOR FREQUENCY DOWN-CONVERTER
DESCRIPTION
The PC1694GR is Silicon monolithic IC for down-converter that is capable of operating up to 1 GHz. This IC consists of double balanced mixer (DBM), local oscillator and IF amplifier. Furthermore, combination with the PC1663G (high-speed video amp) enables it to be applied to a FM demodulation circuit such as DBS tuner. The package is 14-pin SOP suitable for surface mounting.
FEATURES
* Satisfactory 1% cross-modulation distortion characteristics: CM = 103 dB @ fdes = 200 MHz * Wide band operation: f 1 GHz * Easy to connect with varactor diode due to balanced amplifier oscillator * Single-end push-pull IF amplifier suppresses fluctuation in output impedance * Supply voltage: 5 V * Packaged in 14-pin SOP suitable for smaller mounting area
APPLICATIONS
* Tuners for TV and VCR
ORDERING INFORMATION
Part Number Package 14-pin plastic SOP (225 mil) Supplying Form Embossed tape 16 mm wide. Pin 1 indicates pull-out direction of tape.
PC1694GR-E1
Remark To order evaluation samples, please contact your local NEC office. (Part number for sample order: PC1694GR)
Caution Electro-static sensitive devices
The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version.
Not all devices/types available in every country. Please check with local NEC representative for availability and additional information.
Document No. P12965EJ3V0DS00 (3rd edition) Date Published October 1999 N CP(K) Printed in Japan
The mark
shows major revised points.
(c)
1997, 1999
PC1694GR
INTERNAL BLOCK DIAGRAM
OSC Collector OSC Base (Coupling) (Bypass) OSC Base NC (Feed Back)
VCC 7
MIX. Out1 NC 1
OSC Buff. OSC IF Pre Amp. MIX.
IF Main Amp.
8 IF Out (75 Const.)
GND RF In2 (Bypass)
NC RF In1
NC
14 MIX. Out2
PIN CONFIGURATION (Top View)
MIX output 1 GND (Non Connection) OSC base (bypass) OSC base (feedback) OSC collector (coupling) (MIX/IF Amp. switch) 6. GND (Non Connection) 7. VCC 8. IF output (75 ) 9. GND 10. RF input 2 (bypass) 11. GND (Non Connection) 12. RF input 1 13. GND (Non Connection) 14. MIX output 2 1. 2. 3. 4. 5.
1 2 3 4 5 6 7
14 13 12 11 10 9 8
ABSOLUTE MAXIMUM RATINGS (TA = +25C)
Parameter Supply Voltage Power Dissipation Operating Ambient Temperature Storage Temperature Symbol VCC PD TA Tstg TA = +85C Note Conditions Rating 6.0 325 -40 to +85 -65 to +150 Unit V mW C C
Note Mounted on 50 x 50 x 1.6-mm epoxy glass PWB, with copper patterning on both sides.
2
Data Sheet P12965EJ3V0DS00
PC1694GR
RECOMMENDED OPERATING RANGE
Parameter Supply Voltage Operating Ambient Temperature Symbol VCC TA MIN. 4.5 -40 TYP. 5.0 +25 MAX. 5.5 +85 Unit V C
ELECTRICAL CHARACTERISTICS (TA = +25C, VCC = 5 V)
Parameter Circuit Current 1 Mixer Output Voltage Conversion Gain 1 Symbol ICC1 VMIX CG1 No input signal 1-14 pin voltage, No input signal fRF = 55 to 470 MHz, fIF = 50 MHz PRF = -40 dBm RF Input Terminal: Non Tuned fRF = 470 to 890 MHz, fIF = 50 MHz PRF = -40 dBm RF Input Terminal: Non Tuned fRF = 55 to 470 MHz, fIF = 50 MHz RF Input Terminal: Non Tuned fRF = 470 to 890 MHz, fIF = 50 MHz RF Input Terminal: Non Tuned Test Conditions Note 1 Note 1 MIN. 32 -30 14 Note 2 14 Note 3 -- Note 2 -- Note 3 +8 +8 32 17 -- +10 +10 40 21 12.0 -- -- 48 24 15.0 dBm dBm mA dB dB 13.5 16.0 dB 12.5 15.0 dB 18 21 dB TYP. 40 0 18 MAX. 48 +30 21 Unit mA mV dB
Conversion Gain 2
CG2
Noise Figure 1
NF1
Noise Figure 2
NF2
Output Power 1 Output Power 2 Circuit Current 2 (U/IF) Power Gain (U/IF) Noise Figure 3 (U/IF)
PO(sat)1 PO(sat)2 ICC2 GP NF3
fRF = 470 MHz, fIF = 50 MHz, PRF = 0 dBm Note 2 fRF = 890 MHz, fIF = 50 MHz, PRF = 0 dBm Note 3 No input signal fin = 50 MHz, Pin = -40 dBm fin = 50 MHz Note 1 Note 2 Note 2
Notes 1. By test circuit 1 2. By test circuit 2 3. By test circuit 3
Data Sheet P12965EJ3V0DS00
3
PC1694GR
STANDARD CHARACTERISTICS (FOR REFERENCE) (TA = +25C, VCC = 5 V)
Reference Value 24.5
Parameter Conversion Gain 3
Symbol CG3
Test Conditions fRF = 55 MHz, fIF = 50 MHz, PRF = -40 dBm RF Input Terminal: Tuned Note 1 fRF = 200 MHz, fIF = 50 MHz, PRF = -40 dBm RF Input Terminal: Tuned Note 1 fRF = 470 MHz, fIF = 50 MHz, PRF = -40 dBm RF Input Terminal: Tuned Note 1 fRF = 890 MHz, fIF = 50 MHz, PRF = -40 dBm RF Input Terminal: Tuned Note 2 fRF = 55 to 470 MHz, fIF = 50 MHz fRF = 470 to 890 MHz, fIF = 50 MHz fRF = 50 MHz VCC 10%, fOSC = 100 to 520 MHz VCC 10%, fOSC = 520 to 940 MHz fOSC = 100 to 520 MHz fOSC = 520 to 940 MHz Note 1, 3 Note 2, 3 Note 1, 4
Unit dB
Conversion Gain 4
CG4
24.5
dB
Conversion Gain 5
CG5
23.0
dB
Conversion Gain 6
CG6
20.0
dB
1% Cross-modulation Distortion 1 1% Cross-modulation Distortion 2 1% Cross-modulation Distortion 3 (U/IF) Oscillation Frequency Stability 1 Oscillation Frequency Stability 2 Oscillation Stop (Start) Voltage 1 Oscillation Stop (Start) Voltage 2
CM1 CM2 CM3
103 100 103 100 200 2.5 3.0
dB dB dB
fstb1 fstb2 VOSC1 VOSC2
Note 1 Note 2 Note 1 Note 2
kHz
V
Notes 1. By test circuit 2 2. By test circuit 3 3. fundes = fRF 12 MHz, PRF = -31 dBm, fIF = 50 MHz, AM: 100 kHz, 30%Mod., S/I Ratio = 46 dBc, Output 75 Open 4. fin = 50 MHz, fundes = 62 MHz, Pin = -31 dBm, AM: 100 kHz, 30% Mod., S/I Ratio = 46 dBc, Output 75 Open
4
Data Sheet P12965EJ3V0DS00
PC1694GR
TYPICAL CHARACTERISTICS (TA = +25C)
CIRCUIT CURRNT vs. SUPPLY VOLTAGE 60 No Input Signal 50
Circuit Current Icc (mA)
40
30
20
10
0
1
2
3
4
5
6
Supply Voltage VCC (V)
NOISE FIGURE AND CONVERSION GAIN vs. INPUT FREQUENCY 30 VCC = 5 V fIF = 50 MHz RF Input Terminal: No Tuned Test Circuit 2, 3 PRF = -40 dBm
20
Conversion Gain CG (dB) Noise Figure NF (dB)
25
18
20
16
15
14
10
12
5
10
0
500 Input Frequency fRF (MHz)
1000
1200
Data Sheet P12965EJ3V0DS00
5
PC1694GR
CONVERSION GAIN vs. INPUT FREQUENCY VCC = 5 V fIF = 50 MHz RF Input Terminal: Tuned PRF = -40 dBm
30
Conversion Gain CG (dB)
25
20
15
10
5
0
55
200
500 Input Frequency fRF (MHz)
900
1% CROSS-MODULATION DISTORTION vs. INPUT FREQUENCY
1% Cross-modulation Distortion CM (dB)
110
100
90 VCC = 5 V fundes = fRF 12 MHz PRF = -31 dBm fIF = 50 MHz AM: 100 kHz, 30 % Mod. S/I Ratio = 46 dBc Output 75 Open 0 500 Input Frequency fRF (MHz) 1 000 1 200
80
70
60
6
Data Sheet P12965EJ3V0DS00
PC1694GR
OUTPUT POWER vs. INPUT POWER +30 VCC = 5 V fRF = 470 MHz fIF = 50 MHz
Output Power Pout (dBm)
0
-40
-20
0
+20
Input Power Pin (dBm)
OSC-FREQUENCY STABILITY vs. OSCILLATION FREQUENCY +300 VCC 10 % Oscillation Frequency Stability Fstb (kHz)
VCC - 10 % 0 VCC + 10 %
-300
0
500 Oscillation Frequency fOSC (MHz)
1000
1200
Data Sheet P12965EJ3V0DS00
7
PC1694GR
TEST CIRCUIT 1
1 000 pF
V
14
8
1
7
470 pF 1 000 pF A V VCC = 5 V
When measuring circuit current with U/IF Amp, leave pin 5 open.
8
Data Sheet P12965EJ3V0DS00
PC1694GR
TEST CIRCUIT 2
RF Input Terminal: Tuned Symbol fRF = 55 MHz VRF/UIF Input 1 000 pF L2 L1 20 pF C1 C1 L1 Bore 8 pF fRF = 200 MHz 4 pF fRF = 470 MHz 2 pF Input Frequency
Wire diameter : 0.3 mm Wire diameter : 0.4 mm Wire diameter : 0.4 mm : 3.5 mm Bore : 3.2 mm Bore : 3.5 mm Number of turns: 23 T Number of turns: 3 T Number of turns: 2 T
L2 Bore VRF/UIF Input 1 000 pF 1 000 pF 1 000 pF
Wire diameter : 0.3 mm Wire diameter : 0.3 mm Wire diameter : 0.5 mm : 3.5 mm Bore : 4.0 mm Bore : 3.5 mm Number of turns: 32 T Number of turns: 7 T Number of turns: 2 T
IF Output
0.47 H
20 pF
1 10 pF
1.5 pF 1 000 pF 47 pF 1 H 56 pF 47 to 330 Symbol Oscillation Frequency 1 000 pF 47 k L4 L3 fOSC = 300 to 520 MHz Bore Coil used
Wire diameter : 0.5 mm : 3.0 mm Number of turns: 2 T Wire diameter : 0.4 mm : 2.5 mm Number of turns: 3 T Wire diameter : 0.4 mm : 3.0 mm Number of turns: 9 T
4 700 pF 1 k
1 000 pF 1 k
1 000 pF 1 k
47 k HVU306A
L5 3.3 k
L4
L3
1 000 pF 47 k
fOSC = 150 to 300 MHz Bore
L5
fOSC = 100 to 150 MHz Bore
FTC
FTC
FTC
FTC
FTC
FTC
VCC5 VCC4 (BLOW) (BHIGH)
VCC3 (BHYP)
VCC2 VTu = 1 to 29 V (BM2)
VCC1 (BM1)
VLOW VHIGH VHYPER U/IF
VCC1 (BM1) 5V 5V 5V 5V
VCC2 (BM2) 5V 5V 5V OPEN
VCC3 (BHYP) OPEN OPEN 5V OPEN
VCC4 (BHIGH) OPEN 5V OPEN OPEN
VCC5 (BLOW) 5V OPEN OPEN OPEN
Data Sheet P12965EJ3V0DS00
9
PC1694GR
TEST CIRCUIT 3
UHF/RF Input
UHF/RF Input
,, ,,
ZO = 200 = 25 mm 20 pF to 30 pF 47 k
RF Input Terminal: (fRF = 890 MHz) L1 L1: Wire diameter: 0.4 mm, Bore: 3.0 mm, Number of turns: 1 T
1 000 pF
1 000 pF
330//4 pF
1 000 pF
IF Output
1 330 pF
0.5 pF FTC
HVU202
,, ,,
5 pF 5 pF
150 nH 4 pF 8 pF 47 1 000 pF FTC 5 pF FTC
Vtu = 1 to 29 V
VCC2 =5V
VCC1 =5V
10
Data Sheet P12965EJ3V0DS00
PC1694GR
APPLICATION CIRCUIT EXAMPLE 1
For FM demodulator (Example using PC1694GR and PC1663G)
330 pF
VCC1 = 5 V
PC1694GR
47 1 000 pF IF INPUT 1 000 pF Balun 8 7 10 pF L1 L2 HVU306A 47
5 pF 1 000 pF 6 pF
10 pF HVU306A 14 Lag Lead L.P.F. 47 100 pF 47 47 47 100 pF Trap 2 pF L3 8 2 200 pF 4 5 VCC2 = 10 V 1 180
PC1663G
1
VIDEO OUTPUT
1 k
1 k
L1: Wire diameter: 0.3 mm, Bore: 1.5 mm, Number of turns: 13 T L2: Wire diameter: 0.4 mm, Bore: 3.5 mm, Number of turns: 2 T L3: Wire diameter: 0.3 mm, Bore: 1.8 mm, Number of turns: 7 T Balun: TDK WBT5,5P5-C10129E
Data Sheet P12965EJ3V0DS00
11
PC1694GR
APPLICATION CIRCUIT EXAMPLE 2
For TV/VCR TUNER
330 pF IF OUTPUT fIF = 58.75 MHz
VCC = 5 V 1 000 pF
PC1694GR
1 000 pF 8 7 150 nH 47
Dielectric resonator
1st. IF INPUT fRF = 954 MHz (from 1st. IF Amp.) 1 000 pF
330 pF
1 pF 1 pF 5 pF 14 1 VAFT
Filter ATT INPUT
RF Amp.
1st. MIX.
1st. IF Filter
1st. IF
2nd MIX.
2nd IF IF OUTPUT
Buff.
Buff.
PLL
prescaler
1st. Lo OSC
2nd. Lo OSC
PC1694GR
12
Data Sheet P12965EJ3V0DS00
PC1694GR
ILLUSTRATION OF THE APPLICATION CIRCUIT EXAMPLE 2 ASSEMBLED ON EVALUATION BOARD
50 mm
(Front side)
RF1
C1694
RF2
VCC4 (BHIGH) VCC5 (BLOW) VCC3 (BHYP)
1
IF
A
69.5 mm
A'
OSC
Data Sheet P12965EJ3V0DS00
13
14
B VTU VCC1 (BM1) VCC2 (BM2) (Back Side) B'
,, , ,,
, ,,
IF OUTPUT
Data Sheet P12965EJ3V0DS00
L3
L4 RF, U/IF INPUT
L5
Double-sided glass epoxy board through-holes Front and back sides should be matched in A-A' and B-B' : short-circuited strip.
PC1694GR
, ,,
PC1694GR
ILLUSTRATION OF THE APPLICATION CIRCUIT EXAMPLE 1 ASSEMBLED ON EVALUATION BOARD
50 mm
(Front Side)
VIDEO OUT
IF IN
PC1694GR
C1694 C1663
1
A
69.5 mm
A'
Data Sheet P12965EJ3V0DS00
TP1
15
TP2
16
VCC2 B (Back Side) B' VIDEO OUTPUT
PC1663G
Data Sheet P12965EJ3V0DS00
IF INPUT
PC1694GR
VCC1
Double-sided glass epoxy board through-holes Front and back sides should be matched in A-A' and B-B'
PC1694GR
PACKAGE DIMENSION
14 PIN PLASTIC SOP (225 mil)
14
8
detail of lead end
3 -3 1 10.2 0.26 1.49 7
+7
6.55 0.2 4.38 0.1 1.1 0.16
0.6 0.2 1.27 0.40 +0.10 -0.05 0.1 0.1 1.59 +0.21 -0.20 NOTE Each lead centerline is located within 0.10 mm of its true position (T.P.) at maximum material condition. 0.10 M 1.42 MAX 0.15 -0.05
+0.10
0.10
Data Sheet P12965EJ3V0DS00
17
PC1694GR
NOTE ON CORRECT USE (1) Since this IC uses high frequency process, care is required against the excessive input of static electricity, etc. (2) Use the shortest possible wiring for the GND pin. (3) Use the widest possible earth pattern to avoid increase of ground impedance (because it may cause abnormal oscillation). (4) Insert a bypass capacitor for the VCC pin (example: 1 000 pF, 2 200 pF, etc.) (5) Abnormal oscillation may occur depending on the values of the choke coil and floating capacitance. Therefore, insert a resistor between the power supply and choke coil. (See the application circuit example.)
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered under the following recommended conditions. For soldering methods and conditions other than those recommended below, contact your NEC sales representative.
Soldering Method Infrared Reflow Soldering Conditions Package peak temperature: 235 C or below Time: 30 seconds or less (at 210 C) Note Count: 3, Exposure limit: None Package peak temperature: 215 C or below Time: 40 seconds or less (at 200 C) Note Count: 3, Exposure limit: None Soldering bath temperature: 260 C or below Time: 10 seconds or less Note Count: 1, Exposure limit: None Pin temperature: 300 C Time: 3 seconds or less (per side of device) Note Exposure limit: None Recommended Condition Symbol IR35-00-3
VPS
VP15-00-3
Wave Soldering
WS60-00-1
Partial Heating
-
Note After opening the dry pack, keep it in a place below 25 C and 65 % RH for the allowable storage period. Caution Do not use different soldering methods together (except for partial heating). For details of recommended soldering conditions for surface mounting, refer to information document SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (C10535E).
18
Data Sheet P12965EJ3V0DS00
PC1694GR
[MEMO]
Data Sheet P12965EJ3V0DS00
19
PC1694GR
* The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. * No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in this document. * NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from use of a device described herein or any other liability arising from use of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Corporation or others. * Descriptions of circuits, software, and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software, and information in the design of the customer's equipment shall be done under the full responsibility of the customer. NEC Corporation assumes no responsibility for any losses incurred by the customer or third parties arising from the use of these circuits, software, and information. * While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices, the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety measures in its design, such as redundancy, fire-containment, and anti-failure features. * NEC devices are classified into the following three quality grades: "Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on a customer designated "quality assurance program" for a specific application. The recommended applications of a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device before using it in a particular application. Standard: Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) Specific: Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems or medical equipment for life support, etc. The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books. If customers intend to use NEC devices for applications other than those specified for Standard quality grade, they should contact an NEC sales representative in advance.
M7 98. 8

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